Apple's New OLED IPhone Decides To Cut Back On RFPCB

- Apr 09, 2018 -

  Apple's next new OLED iPhone has decided to reduce the use of hard- and soft-print boards, replacing them with a cheaper, less advanced, multi-layer flexible printed circuit board called Multi-FPCBs, according to reports.South Korean website The Investor reports that RFPCB is a key part of the iPhone X embedded chip and panel, while the new OLED iPhone's touch panel, due to be published in September, may use a multilayer flexible printed circuit board, largely based on price and production considerations.Currently, the three biggest manufacturers of printed circuit boards in South Korea, Lakimg Innote RFPCB Interflex and Yongfeng Electronics, supply RFPCBs, but Apple also initially faced a series of problems with RFPCB adoption, such as before the launch of the iPhone X.A factory failed to win orders for failing to meet quality standards. The key reason for the iPhone X's earlier cold crash was the connection of the RFPCB module, for which Apple launched a massive investigation.It also led to a temporary shutdown of several parts supply plants.It remains to be seen whether Apple will require existing suppliers to switch to multilayer flexible printed circuit boards, increase supplies, or directly replace suppliers.PCB, a South Korean company, said it had previously considered offering Apple a multilayer flexible printed circuit board, but had given up because the price it had proposed was too low.Apple will release three new iPhones this year, one for the LCD and two for the OLED, with 5.85-inch and 6.46-inch OLED panels supplied by the Samsung display SDI.

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